Wafer Sizes and Types
      2" to 150mm for all processes
      200mm capabilities in development
      Si, InP, Li Niobate, Li Titanate, quartz, glass, ceramic
      200mm & 300mm capabilities in development

Processes Include
      Litho
      Wet etch and clean
      Dry etch
      Vacuum deposition processes
      Plating

Some Alta Equipment
      Quintel 7000 aligner with backside capabilities
      Ultratech 2700 steppers
      MRC metal sputtering systems
      Deposition and etch cluster tool
      SEM, EDX

Alta Fab Minimum Feature Sizes
      1.1um
      0.9 um in development

Outsource Alliance Capabilities
      200mm AND 300mm full fabs
      130nm minimum features
      100nm minimum features in development